Ipuleti lokupholisha le-wafer le-ceramic le-alumina elingu-99.7% le-CMP

I-Chemshunipuleti lokupholisha le-alumina wafer/turn table yenziwe ngobumsulwa obuphezulu obungu-99.7-99.9% we-alumina. I-ceramic ye-alumina emsulwa kakhulu inokuqina okuvelele kanye nokumelana okuhle kakhulu nokuguguleka kokupholisha i-wafer futhi igcina isimo esihle sobuso isikhathi eside. Yakhiwe yi-PIBM. Ilungu lomkhakha we-semiconductor ngenxa yokuqina kwayo okungenakuqhathaniswa kokushisa nobukhulu kanye nokumelana nezimo ezinzima zemishini yokucubungula ama-microchip.

I-Chemical-Mechanical Planarization (CMP), eyaziwa nangokuthi i-Chemical-Mechanical Polishing, iwubuchwepheshe enqubweni yokukhiqiza amadivayisi e-semiconductor. Isebenzisa ukugqwala kwamakhemikhali kanye namandla omshini ukuze i-silicon wafers noma ezinye izinto ezingaphansi komhlaba zithambile ngesikhathi sokucubungula.

Imishini ye-CMP ihlukaniswe kakhulu izingxenye ezimbili: ingxenye yokupholisha kanye nengxenye yokuhlanza. Ingxenye yokupholisha inezingxenye ezine, okungukuthi ama-turntable amathathu okupholisha kanye nemodyuli yokulayisha nokukhipha i-wafer. Ingxenye yokuhlanza inesibopho sokuhlanza nokomisa i-wafer ukuze kufezwe "ukomisa nokufaka" i-wafer. Kuyo yonke imishini yokupholisha, i-alumina ceramics idlala indima ebalulekile.

I-Alumina ceramics ivame ukusetshenziselwa ukulungisa ama-wafer polishing disc, adinga ubumsulwa obukhulu, ukuqina kwamakhemikhali aphezulu, kanye nokulawula okuhle ukuma kwendawo kanye nokuqina kwayo.

Idiski yokugaya ye-ceramic ye-Chemshun 99.7% Al2O3 yenziwe ngezinto zobumba ezithuthukisiwe, ezifanelekela ukugaya izinto ezahlukahlukene kahle, ikakhulukazi ukugaya izinto ezibuthakathaka njenge-wafers, i-ceramics kanye nengilazi. Idiski yethu yokugaya ye-ceramic ingenziwa ngosayizi abahlukene ngokuya ngamamodeli ahlukene okugaya nokupholisha.